EBG designs for mitigating radio frequency interference

ABSTRACT

An apparatus for electromagnetic interference shielding is described herein. The apparatus includes an electromagnetic bandgap (EBG) structure. The EBG structure is attached to a surface of the apparatus such that noise propagation is mitigated. The apparatus may be a chassis of an electronic device, and the EBG structure may be attached to one surface of the chassis. Further, the apparatus may be a heat sink, and the EBG structure can be attached to one surface of the heat sink.

TECHNICAL FIELD

The present techniques generally relate to radio frequency interference.More specifically, the present techniques relate to preventing radiofrequency interference within a chassis.

BACKGROUND ART

Computing platforms such as computing systems, tablets, laptops, mobilephones, and the like are housed within a chassis. As the size of thesedevices gets smaller, interference from various motherboard componentsand digital transmissions are in closer proximity to various wirelessantennas of the device.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram of a computing device that may includestructured stereo;

FIG. 2 illustrates two chassis designs with platform noise;

FIG. 3 is a mushroom type EBG structure;

FIG. 4 is an illustration of several EBG structure designs; and

FIG. 5 is an EBG design under a thermal device;

FIG. 6 is an EBG adhesive tape; and

FIG. 7 is a process flow diagram for constructing an electronic devicewith electromagnetic interference shielding.

The same numbers are used throughout the disclosure and the figures toreference like components and features. Numbers in the 100 series referto features originally found in FIG. 1; numbers in the 200 series referto features originally found in FIG. 2; and so on.

DESCRIPTION OF THE EMBODIMENTS

As noted above, smaller computing devices result in interference from amotherboard and the resulting digital transmissions being in closerproximity to wireless antennas of the device. The mobile computerindustry has been evolving, in a fast pace to small computing devicessuch as ultrabook and tablet designs. Integrating wireless standardssuch as a those according to the WiFi Alliance (WiFi), networks thatcomply with the International Mobile Telecommunications-2000 (IMT-2000)specifications (3G), and Long Term Evolution (LTE) standards intocompact ultrabook or tablet form factors can be challenging aselectromagnetic noise generated from components such as the centralprocessing unit (CPU), platform controller hub (PCH), double data rate(DDR) memory, panel timing controller, motherboard layout, and the likeare now in much closer proximity to the antennas. Additionally, antennasmay be placed within the same enclosure or chassis as the motherboard.Furthermore, the chassis is typically a metal enclosure, which in turnserves as a propagation path for the electromagnetic interference asopposed to a shield for the electromagnetic interference. Thisinterference or noise received by the antenna can degrade wirelessperformance, such as throughput, and deteriorate user experience.

Embodiments described herein enable electromagnetic bandgap (EBG)designs for mitigating radio frequency interference, also known aselectromagnetic interference (EMI). In an embodiment, an EBG structureis attached to the surface of an apparatus such that noise propagationis mitigated within a chassis. The EBG structure can be a mushroom typeEBG structure, and the EBG structure can be integrated into the surfaceof the apparatus. Using the present techniques, electromagneticinterference can be mitigated without the addition of printed circuitboard (PCB) layers used in typical electromagnetic interferenceshielding. The use of the EBG structure to mitigate electromagneticinterference can achieve global isolation where interference ismitigated throughout the entire chassis. The use of the EBG structure tomitigate electromagnetic interference can also achieve local isolationwhere interference is removed from a portion of the chassis, such as anarea surrounding the antennas of the computing device. In some cases theEBG structure is integrated with or coupled to a portion of the chassisor a thermal device of the computing device. In this manner, the presenttechniques are a flexible design that can be applied to a number ofchassis implementations.

In the following description and claims, the terms “coupled” and“connected,” along with their derivatives, may be used. It should beunderstood that these terms are not intended as synonyms for each other.Rather, in particular embodiments, “connected” may be used to indicatethat two or more elements are in direct physical or electrical contactwith each other. “Coupled” may mean that two or more elements are indirect physical or electrical contact. However, “coupled” may also meanthat two or more elements are not in direct contact with each other, butyet still co-operate or interact with each other.

Some embodiments may be implemented in one or a combination of hardware,firmware, and software. Some embodiments may also be implemented asinstructions stored on a machine-readable medium, which may be read andexecuted by a computing platform to perform the operations describedherein. A machine-readable medium may include any mechanism for storingor transmitting information in a form readable by a machine, e.g., acomputer. For example, a machine-readable medium may include read onlymemory (ROM); random access memory (RAM); magnetic disk storage media;optical storage media; flash memory devices; or electrical, optical,acoustical or other form of propagated signals, e.g., carrier waves,infrared signals, digital signals, or the interfaces that transmitand/or receive signals, among others.

An embodiment is an implementation or example. Reference in thespecification to “an embodiment,” “one embodiment,” “some embodiments,”“various embodiments,” or “other embodiments” means that a particularfeature, structure, or characteristic described in connection with theembodiments is included in at least some embodiments, but notnecessarily all embodiments, of the present techniques. The variousappearances of “an embodiment,” “one embodiment,” or “some embodiments”are not necessarily all referring to the same embodiments. Elements oraspects from an embodiment can be combined with elements or aspects ofanother embodiment.

Not all components, features, structures, characteristics, etc.described and illustrated herein need be included in a particularembodiment or embodiments. If the specification states a component,feature, structure, or characteristic “may”, “might”, “can” or “could”be included, for example, that particular component, feature, structure,or characteristic is not required to be included. If the specificationor claim refers to “a” or “an” element, that does not mean there is onlyone of the element. If the specification or claims refer to “anadditional” element, that does not preclude there being more than one ofthe additional element.

It is to be noted that, although some embodiments have been described inreference to particular implementations, other implementations arepossible according to some embodiments. Additionally, the arrangementand/or order of circuit elements or other features illustrated in thedrawings and/or described herein need not be arranged in the particularway illustrated and described. Many other arrangements are possibleaccording to some embodiments.

In each system shown in a figure, the elements in some cases may eachhave a same reference number or a different reference number to suggestthat the elements represented could be different and/or similar.However, an element may be flexible enough to have differentimplementations and work with some or all of the systems shown ordescribed herein. The various elements shown in the figures may be thesame or different. Which one is referred to as a first element and whichis called a second element is arbitrary.

FIG. 1 is a block diagram of a computing device 100 that may include anEBG structure design. The computing device 100 may be, for example, alaptop computer, desktop computer, tablet computer, ultrabook, mobiledevice, or server, among others. The computing device 100 may include acentral processing unit (CPU) 102 that is configured to execute storedinstructions, as well as a memory device 104 that stores instructionsthat are executable by the CPU 102. The CPU may be coupled to the memorydevice 104 by a bus 106. Additionally, the CPU 102 can be a single coreprocessor, a multi-core processor, a computing cluster, or any number ofother configurations. Furthermore, the computing device 100 may includemore than one CPU 102. The memory device 104 can include random accessmemory (RAM), read only memory (ROM), flash memory, or any othersuitable memory systems. For example, the memory device 104 may includedynamic random access memory (DRAM).

The computing device 100 may also include a graphics processing unit(GPU) 108. As shown, the CPU 102 may be coupled through the bus 106 tothe GPU 108. The GPU 108 may be configured to perform any number ofgraphics operations within the computing device 100. For example, theGPU 108 may be configured to render or manipulate graphics images,graphics frames, videos, or the like, to be displayed to a user of thecomputing device 100. The computing device may also include atransmitter/receiver 110. In some cases, the transmitter/receiver 110 isa transceiver. The transmitter/receiver 110 may include various antennasinto order to transmit and receive wireless data. Electromagneticinterference from other components of the computing device 100 cancorrupt signals transmitted or received by the transmitter/receiver 110.In some cases, electromagnetic interference created by the transmissionof data across a motherboard of the computing device 100 results in atotal loss of data at the transmitter/receiver 110. Further, theelectromagnetic interference can be a result of digital data transmittedwithin the computing device 100. For example, digital signalstransmitted across a microstrip routed along the PCB can contribute tothe electromagnetic interference, as well as any integrated circuits andchipsets within the computing device 100. The present techniques can beused to mitigate the electromagnetic interference created by themotherboard, data transmission, integrated circuits and chipsets,thereby enabling the transmitter/receiver 110 to transmit or receive aclean signal.

The CPU 102 may be connected through the bus 106 to an input/output(I/O) device interface 112 configured to connect the computing device100 to one or more I/O devices 114. The I/O devices 114 may include, forexample, a keyboard and a pointing device, wherein the pointing devicemay include a touchpad or a touchscreen, among others. The I/O devices112 may be built-in components of the computing device 100, or may bedevices that are externally connected to the computing device 100.

The CPU 102 may also be linked through the bus 106 to a displayinterface 116 configured to connect the computing device 100 to displaydevices 118. The display devices 118 may include a display screen thatis a built-in component of the computing device 100. The display devices118 may also include a computer monitor, television, or projector, amongothers, that is externally connected to the computing device 100.

The computing device also includes a storage device 120. The storagedevice 120 is a physical memory such as a hard drive, an optical drive,a thumbdrive, an array of drives, or any combinations thereof. Thestorage device 120 may also include remote storage drives. The computingdevice 100 may also include a network interface controller (NIC) 122that may be configured to connect the computing device 100 through thebus 106 to a network 124. The network 124 may be a wide area network(WAN), local area network (LAN), or the Internet, among others.

The block diagram of FIG. 1 is not intended to indicate that thecomputing device 100 is to include all of the components shown inFIG. 1. Further, the computing device 100 may include any number ofadditional components not shown in FIG. 1, depending on the details ofthe specific implementation.

In some cases, a chassis of the computing device 100 is a metalenclosure that serves as a propagation path for electromagneticinterference from components of the computing device on the antennas ofthe computing device 100 instead of a shield. As discussed above, theelectromagnetic interference created within a platform of a computingdevice can corrupt a radio signal received at a receiver or transceiverof the computing device. Using the present techniques, theelectromagnetic interference can be directed away from the antennas ofthe device, thereby shielding the antennas from the interference. Inembodiments, the EBG structure and be integrated with or attached to thechassis of the computing device in order to mitigate the transmission ofelectromagnetic interference. The EBG structure can mitigateelectromagnetic interference through an attachment or integration with aportion of the chassis. In examples, the EBG structure is attached to orintegrated with one side of the chassis. Thus, the EBG structure doesnot need to extend throughout the entire chassis in order to mitigateelectromagnetic interference.

Typically, the noise source on the motherboard is shielded usingelectromagnetic interference shielding cages mounted onto the PCB.However, electromagnetic interference shielding cages are a costlysolution and can increase a Z-height of the motherboard. Thus,additional layers may be added to the PCB in order to accommodate theelectromagnetic interference shielding cages. Moreover, the motherboardhas to implement mounting pads on the surface layers of the PCB toaccommodate the electromagnetic interference shielding cages, whichlimits the microstrip routing on the PCB. Accordingly, the circuitlayout is limited on the PCB by the shielding cage. Moreover, a PCB withadditional layers further increases the cost of the PCB. Usingelectromagnetic interference shielding cages can result in thermaldesign issues as well, since the cages can block the air flow forcooling and also make the conventional heat spreader/heat pipe difficultto be implemented in the device design. The EBG structures implementedas a portion of the chassis or thermal device do not block cooling ofthe device. Further, the EBG structures implemented as a portion of thechassis or thermal device do not result in additional layers of the PCB.

FIG. 2 illustrates two chassis designs with platform noise. FIG. 2includes a design 202 and a design 204. The design 202 includes achassis 206 with a noise producing component 208. In embodiments, thenoise producing component is any component of a computing device thatemits noise that can corrupt operation of the device according to awireless standard. For example, the noise producing component 208 may bea CPU, PCH, memory device, panel timing controller, chipset, integratedcircuit, and the like. The noise producing component may traces alongthe motherboard.

The noise producing component 208 is coupled with a printed circuitboard (PCB) 210. The design 202 also includes an antenna 212. Asillustrated in FIG. 2, noise, radio frequency interference, orelectromagnetic interference 214 freely travels to the antenna 212 fromthe noise producing component 208. In some cases, the chassis 206 servesas a propagation path for the electromagnetic interference 214 to travelto the antenna 212, such that the chassis 206 guides the electromagneticinterference 214 to the antenna 212. The electromagnetic interference214 can corrupt signals sent or received by the antenna 212.

Similarly, the design 204 includes a chassis 206 with a noise producingcomponent 208 coupled with a PCB 210. However, a thermal device 216 iscoupled with a thermal interface material 218 and the noise producingcomponent 208. The thermal device 216 can be a heat sink, heat spreader,heat pipe, or the like. As illustrated, the thermal device 216 can guidethe noise or electromagnetic interference 214. However, theelectromagnetic interference still travels to the antenna 212, where itmay corrupt a signal sent or received by the antenna 212.

The thermal device can be used with an electromagnetic bandgap (EBG)structure to prevent propagation of the noise or electromagneticinterference. The EBG structure may also be applied to the chassis ofthe computing device in order to prevent propagation of electromagneticinterference throughout the chassis of the computing device. In somecases, the EBG structure is designed as integrated into the chassis,prior to the manufacture of the chassis. In some cases, the EBGstructure is applied to the chassis or heat spreader after the designand manufacture of the device. In embodiments, the EBG structure may bean adhesive tape which that transforms a conventional metal chassis toan EBG-type chassis using the present techniques.

FIG. 3 is a mushroom type EBG structure 300. The mushroom type EBGstructure includes a plurality of mushrooms 302A, 302B, and 302C. TheEBG structure can be a periodic mushroom EBG structure. In some cases,each mushroom EBG structure 302 includes a metal post with a metal topwhich resembles a “T” or a mushroom. The lower portion of the pluralityof mushrooms may be a solid metal plane. The solid metal plane can beused to couple the plurality of mushroom type EBG surfaces with asurface of a chassis or thermal device, such as a heat sink, heatspreader, heat pipe, or the like. Such an EBG design can transform a lowimpedance surface into a high impedance surface for a selectivefrequency band. In some cases, the impedance initially observed withinthe chassis is a function of the inductance L at reference number 304and the capacitance C at reference number 306. In examples, an increasein capacitance 306 or decrease in inductance 304 results in a decreasein impedance. Further, an increase in inductance 304 and a decrease incapacitance 306 may result in an increase in impedance. In some cases,the EBG structure increases the inductance observed by electromagneticinterference within a chassis such that the chassis includes a highimpedance surface that mitigates the propagation of electromagneticinterference.

Although mushroom type EBG structures are described herein, any EBGstructure can be used to mitigate the propagation of electromagneticinterference according to the present techniques. For example, the EBGstructures may be a spiral EBG structure, wide band EBG structure, or aplanar EBG structure. Further, several types of EBG structures can becombined in a single design to mitigate electromagnetic interferencewithin a single chassis. Several types of EBG structures can be combinedin a single design coupled with a thermal device in order to mitigateelectromagnetic interference within a single chassis. Moreover, thepresent techniques include an EBG structure that can be applied to achassis surface of any material. Accordingly, a chassis with a metalcoating may be using according to the present techniques. Further, achassis that includes a metal foil, such as an aluminum foil attached toan interior portion of the chassis. In embodiments, the metal coating ormetal foil of the chassis can be positioned along with the EBG structurein order to direct any electromagnetic interference away from antennaswithin the chassis. Additionally, each of the exemplary WiFi, 3G, andLTE standards include wireless antennas that may operate at differentfrequencies. Accordingly, the EBG structure design can be modified tomitigate electromagnetic interference on each type of antenna, eitheralone or in any combination. For example, depending on the design of theEBG structure, the electromagnetic interference frequency band mitigatedcan be made large, small, or target a particular range depending on theEBG structure.

FIG. 4 is an illustration of several EBG structure designs 400. Thedesigns 400 include an EBG structure design 402, an EBG structure design404, and an EBG structure design 406. The each design includes a noiseproducing component 408 attached to a printed circuit board (PCB) 410,and an antenna 412. The EBG structure design 402 illustrates an EBGstructure 414A implemented above the noise producing component 408.Accordingly, the noise 416A is mitigated by the EBG structure 414A andprevented from traveling to the antenna 412. Similarly, the EBGstructure design 404 illustrates an EBG structure 414B implemented aboveand to each side of the noise producing component 408. Accordingly, thenoise 416B is mitigated by the EBG structure 414B and prevented fromtraveling to the antenna 412. The EBG structures 414A and 414B can beused to achieve global isolation that mitigates the electromagneticinterference throughout the chassis of the computing device. The EBGstructures 414A and 414B are able to mitigate electromagneticinterference by attaching the EBG structures 414A and 414B to one sideof the chassis. Moreover, the EBG structures 414A and 414B can beintegrated with the chassis, or the EBG structures 414A and 414B can beapplied to the chassis using an EBG adhesive tape as described in FIG.6.

The EBG structure design 406 illustrates an EBG structure 414Cimplemented around the antenna 412. Accordingly, the noise 416C ismitigated by the EBG structure 414C and prevented from traveling to theantenna 412. In this manner, the surfaces of chassis become highimpedance through the addition of the EBG surface. The design 406implements the EBG structure 414C by surrounding the antenna 412 in thedesign 406. The EBG structure 414C can, therefore, provide localisolation to the antenna 412.

FIG. 5 is an EBG design 500 under a thermal device. The design 500includes a noise producing component 502 attached to a printed circuitboard (PCB) 504, and an antenna 506. The EBG design 500 is implementedwithin a chassis 508. The EBG design 500 includes a thermal device. Forexemplary purposes, the thermal device is a heat spreader 510, howeverany thermal device may be used. The heat spreader 510 is coupled with athermal interface material 512. An EBG structure 514 is coupled with theheat spreader 510. The EBG structure may be integrated with the heatspreader 510, or the EBG structure can be applied to the heat spreader510 using an EBG adhesive tape as described in FIG. 6. The EBG structure514 is implemented above the noise producing component 502. Theelectromagnetic interference 516 is mitigated by the EBG structure 514coupled with the heat spreader 510. The electromagnetic interference 516is prevented from traveling to the antenna 506.

Accordingly, the EBG structure implementation is flexible. To preventthe noise from coupling to the antenna, the EBG can be implemented abovethe noise source, surrounding the noise source, or surrounding theantenna. The EBG design according to present techniques can be thin andlight compared to shielding cages. In some cases, the EBG design neitherblocks air flow nor impacts thermal design of the computing device.Further, the EBG structure does not require a connection between top andbottom portions of the chassis. As described above, the EBG structurecan be implemented directly through an industrial design. For example,the EBG structure can be implemented when the chassis is designed. Also,an EBG adhesive tape can be used to retrofit an existing chassis with anEBG design in order to mitigate electromagnetic interference. The EBGadhesive tape can be implemented after the design of the chassis inorder to mitigate electromagnetic interference.

FIG. 6 is an EBG adhesive tape 600. The tape 600 can be attached to achassis surface or heat spreader in order to make the surface highimpedance and mitigate electromagnetic interference. The tape 600includes a conductive adhesive layer 602. An insulation layer 604 iscoupled with the conductive adhesive layer 602 and includes a pluralityof EBG structures 608. The tape 600 can be applied to any surface usingthe conductive adhesive layer 602. In this manner, any surface within achassis can be transformed to a high impedance structure in order tomitigate the propagation of electromagnetic interference throughout thechassis. Accordingly, the entire chassis may be converted to a highimpedance EBG structure through the use of the tape 600. In examples,the tape 600 is applied to a single side of the chassis. In otherexamples, the tape 600 is applied to a thermal device.

FIG. 7 is a process flow diagram 700 for constructing an electronicdevice with electromagnetic interference shielding. At block 702, anenclosure including an electromagnetic bandgap (EBG) structure isformed. In some cases, the enclosure is a chassis that includes an EBGstructure as part of the industrial design of the chassis. Additionally,in some cases, the EBG structure is applied to the chassis as an EBGadhesive tape after the design of the chassis. At block 704, an antennais located within the structure, such that the noise from the antenna isblocked by the EBG structure. Accordingly, the antenna may be located ina position within the chassis wherein the electromagnetic interferencefrom the digital communications within the chassis is mitigated. As aresult, EBG structures as described herein can be used to stop noisepropagation. When the noise propagates through the chassis, the noise isreflected by the EBG structure surrounding the antenna. In this manner,the antenna receives less noise when compared to a chassis without EBGstructures.

Example 1

An apparatus for electromagnetic interference shielding is describedherein. The apparatus includes an electromagnetic bandgap (EBG)structure. The EBG structure is attached to a surface of the apparatussuch that the EBG structure is to mitigate electromagnetic interferencepropagation within the apparatus.

The apparatus may be a chassis of an electronic device, and the EBGstructure may be attached to one surface of the chassis. The apparatusmay be a heat sink, and the EBG structure may be attached to one surfaceof the heat sink, or the apparatus may be a heat pipe, and the EBGstructure may be attached to one surface of the heat pipe. Additionally,the apparatus may be a heat spreader, and the EBG structure may beattached to one surface of the heat spreader. The EBG structure may beadjusted to block a frequency band electromagnetic interference, suchthat a selective frequency of electromagnetic interference may bemitigated. The EBG structure may be a mushroom type EBG structure.Further, the EBG structure may be integrated into the surface of theapparatus. The EBG structure may also be attached to the surface of theapparatus using an adhesive. The EBG structure is to mitigateelectromagnetic interference without impacting a thermal design of theapparatus.

Example 2

A method for constructing an electronic device with electromagneticinterference shielding is described herein. The method includes formingan enclosure of the electronic device, where the enclosure includes anelectromagnetic bandgap (EBG) structure. The method also includeslocating an antenna and a plurality of noise producing components withinthe enclosure to block noise from the plurality of noise producingcomponents from the antenna.

The EBG structure may be a mushroom type EBG structure, or the EBGstructure may be integrated with the enclosure. An arrangement of theEBG structure on the enclosure may be generated during an industrialdesign of the enclosure. The noise producing components include at leasta central processing unit (CPU), platform controller hub (PCH), memorydevice, panel timing controller, motherboard layout, or any combinationthereof. The EBG structure may be selected to mitigate a frequency bandof the electromagnetic interference to block a selective frequency ofthe electromagnetic interference. The enclosure may include a metalliccoating that directs the electromagnetic interference away from theantenna. Additionally, the metallic coating may direct theelectromagnetic interference from the noise producing componentsthroughout the entire chassis. The enclosure may be an electromagneticinterference metal enclosure. Further, the antenna can transmit signalssuch as Wifi, 3G, LTE, or any combination thereof.

Example 3

A method for fitting an electronic device for electromagneticinterference shielding is described herein. The method includesattaching an electromagnetic bandgap (EBG) adhesive tape to a surfacewithin the electronic device to prevent noise from interfering with theoperation of an antenna.

The surface may be a housing of the electronic device. The EBG adhesivetape may include a conductive adhesive layer. The EBG adhesive tape mayinclude a mushroom type EBG structure. The surface may be a portion of ahousing of the electronic device. Further, the surface may be a heatsink, and the EBG adhesive tape may be attached to one surface of theheat sink, or the surface may be a heat pipe, and the EBG adhesive tapemay be attached to one surface of the heat pipe. The surface may also bea heat spreader, and the EBG adhesive tape may be attached to onesurface of the heat spreader. The EBG adhesive tape may include an EBGstructure that is selected to mitigate a portion of the noise, such thata selective frequency of the noise may be blocked. The EBG adhesive tapecan mitigate noise propagation without impacting a thermal design of theelectronic device.

Example 4

An apparatus for electromagnetic interference shielding is describedherein. The apparatus includes a means for suppressing noise. The meansfor suppressing noise is attached to a surface of the apparatus suchthat the means for suppressing noise is to mitigate noise propagation.

The apparatus may be a chassis of an electronic device, and the meansfor suppressing noise may be attached to one surface of the chassis. Theapparatus may be a heat sink, and the means for suppressing noise may beattached to one surface of the heat sink, or the apparatus may be a heatpipe, and the means for suppressing noise may be attached to one surfaceof the heat pipe. The apparatus may also be a heat spreader, and themeans for suppressing noise may be attached to one surface of the heatspreader. The means for suppressing noise may be designed to block afrequency band of electromagnetic interference, such that a selectivefrequency of electromagnetic interference may be mitigated. Further, themeans for suppressing noise may be a mushroom type EBG structure. Themeans for suppressing noise may also be integrated into the surface ofthe apparatus. Additionally, the means for suppressing noise may beattached to the surface of the apparatus using an adhesive. The meansfor suppressing noise can mitigate electromagnetic interference withoutimpacting a thermal design of the apparatus.

It is to be understood that specifics in the aforementioned examples maybe used anywhere in one or more embodiments. For instance, all optionalfeatures of the computing device described above may also be implementedwith respect to either of the methods described herein or acomputer-readable medium. Furthermore, although flow diagrams and/orstate diagrams may have been used herein to describe embodiments, thepresent techniques are not limited to those diagrams or to correspondingdescriptions herein. For example, flow need not move through eachillustrated box or state or in exactly the same order as illustrated anddescribed herein.

The present techniques are not restricted to the particular detailslisted herein. Indeed, those skilled in the art having the benefit ofthis disclosure will appreciate that many other variations from theforegoing description and drawings may be made within the scope of thepresent techniques. Accordingly, it is the following claims includingany amendments thereto that define the scope of the present techniques.

What is claimed is:
 1. An apparatus for electromagnetic interferenceshielding, comprising: an electromagnetic bandgap (EBG) structure; asurface of the apparatus, wherein the EBG structure is disposed onto thesurface and in between an interference generating source and an antenna,wherein the EBG structure is to provide isolation to the antenna from anelectromagnetic interference band comprising an operating frequency ofthe antenna generated by the interference generating source coupled toan opposing surface of a printed circuit board from the surface of theapparatus, the apparatus comprising a chassis enclosing the printedcircuit board, the antenna, and the interference generating source,wherein the printed circuit board, the antenna, and the interferencegenerating source are attached to the chassis, wherein the chassiscomprises a metal enclosure that serves as a propagation path for theelectromagnetic interference band from the interference generatingsource and the EBG structure prevents propagation of the electromagneticinterference band to the antenna.
 2. The apparatus of claim 1, whereinthe EBG structure is integrated into one surface of the chassis.
 3. Theapparatus of claim 1, comprising a heat sink, wherein a second EBGstructure integrated into to one surface of the heat sink.
 4. Theapparatus of claim 1, comprising a heat pipe, wherein a second EBGstructure is integrated into one surface of the heat pipe.
 5. Theapparatus of claim 1, comprising a heat spreader, wherein a second EBGstructure is integrated into one surface of the heat spreader.
 6. Theapparatus of claim 1, wherein the EBG structure is a mushroom type EBGstructure.
 7. The apparatus of claim 1, wherein a second EBG structureis attached to the surface of the apparatus using an adhesive such thatthe second EBG structure is an EBG adhesive tape.
 8. The apparatus ofclaim 1, wherein the EBG structure comprises a combined plurality oftypes of EBG structures, wherein the plurality of types of EBGstructures comprises a spiral EBG structure, a wide band EBG structure,a planar EBG structure, or any combination thereof.
 9. The apparatus ofclaim 1, wherein a metal coating or a metal foil of the chassis can bepositioned along with the EBG structure in order to direct anyelectromagnetic interference away from antennas within the chassis. 10.A method for constructing an electronic device with electromagneticinterference shielding, comprising: forming an enclosure of theelectronic device, where an electromagnetic bandgap (EBG) structure isdisposed onto an inner surface of the enclosure; locating an antenna anda plurality of interference generating sources within the enclosure toblock noise from the plurality of interference generating sources fromthe antenna, wherein the EBG structure is implemented in between theinterference generating sources and the antenna to provide isolation tothe antenna from an electromagnetic interference band comprising anoperating frequency of the antenna generated by a component of theplurality of interference generating sources coupled to an opposingsurface of a printed circuit board from the surface of the apparatus,the enclosure comprising a chassis enclosing the printed circuit board,the antenna, and the interference generating source, wherein the printedcircuit board, the antenna, and the interference generating source areattached to the chassis, wherein the chassis comprises a metal enclosurethat serves as a propagation path for the electromagnetic interferenceband from the interference generating source and the EBG structureprevents propagation of the electromagnetic interference band to theantenna.
 11. The method of claim 10, wherein the EBG structure is amushroom type EBG structure.
 12. The method of claim 10, wherein EBGstructure is integrated with the enclosure.
 13. The method of claim 10,wherein an arrangement of the EBG structure on the enclosure isgenerated during an industrial design of the enclosure.
 14. The methodof claim 10, wherein the interference generating sources include atleast a central processing unit (CPU), platform controller hub (PCH),memory device, panel timing controller, motherboard layout, or anycombination thereof.
 15. The method of claim 10, wherein the EBGstructure is selected to mitigate a frequency band of theelectromagnetic interference, to block a selective frequency of theelectromagnetic interference.
 16. The method of claim 10, wherein theenclosure includes a metallic coating that directs the electromagneticinterference away from the antenna.
 17. The method of claim 10, whereina metallic coating directs the electromagnetic interference from theinterference generating sources throughout the enclosure.
 18. A methodfor fitting an electronic device for electromagnetic interferenceshielding, comprising: attaching an electromagnetic bandgap (EBG)adhesive tape comprising an electromagnetic bandgap (EBG) structure to asurface in between an antenna and an interference generating sourcewithin the electronic device to prevent noise generated by theinterference generating source from interfering with the operation ofthe antenna, wherein the EBG structure is to mitigate an electromagneticinterference band comprising an operating frequency of the antenna, andwherein the interference generating source is coupled to an opposingsurface of a printed circuit board from the surface of a chassis of theelectronic device, the chassis enclosing the printed circuit board, theantenna, and the interference generating source, wherein the printedcircuit board the antenna, and the interference generating source areattached to the chassis, wherein the chassis comprises a metal enclosurethat serves as a propagation path for the electromagnetic interferenceband from the interference generating source and the EBG structureprevents propagation of the electromagnetic interference band to theantenna.
 19. The method of claim 18, wherein the surface is a housing ofthe electronic device.
 20. The method of claim 18, wherein the EBGadhesive tape includes a conductive adhesive layer.
 21. The method ofclaim 18, wherein the EBG adhesive tape includes a mushroom type EBGstructure.
 22. The method of claim 18, wherein the surface is a portionof a housing of the electronic device.
 23. The method of claim 18,wherein the surface is a heat sink, and the EBG adhesive tape isattached to one surface of the heat sink.
 24. The method of claim 18,wherein the surface is a heat pipe, and the EBG adhesive tape isattached to one surface of the heat pipe.
 25. The method of claim 18,wherein the surface is a heat spreader, and the EBG adhesive tape isattached to one surface of the heat spreader.